UV laser marking machine with its 355nm wavelength is versatile in marking a wide range of materials is perfect for "cold marking" applications where heat zones are not allowed - the UV will mark plastics and silicon materials without the need of additives and will also mark glass with drastically reduced risk of microfracture.
The excellent beam quality also affords this laser the ability to be utilized in micro marking applications such as electronics, circuit boards and microchips in addition to solar panels and precise medical marking applications.
It takes advantage of the short UV wavelength to provide a small spot size and a large depth of focus.
UV lasers also take advantage of the cold marking process, not requiring high average powers and allowing damage free marking on many materials.
Application Marerials:
Wires, metals, sapphire, glass, diamond, polyamides, PCBs, coatings, ITO removal, silicon wafers, ceramics, plastics, fiber, paper, polyimides, etc.
Application Industries:
The UV wavelength produces less mechancial distortion and less heat affected zones in comparision with longer laser wavelengths.
The extremely high precision of UV lasers make them ideal for the demaning marking material process applications such as glass and non-doped plastics in the automotive, healthcare, aeronautics, solar, electrical industry and many others.